Method for identifying defective elements in array molding of semiconductor packaging

ABSTRACT

The present invention is a method for identifying defective elements in array molding of semiconductor packaging for mini BGA packaging substrate which comprises a circuit zone and a periphery zone. The method of the present invention is first to form a plurality of package sites disposed in array in the circuit zone, and to form a plurality of marks in a periphery zone. When a defective element is found in the package sites, a symbol is put at the mark or an electronic file is employed to record the location of the defective element, thereby, the defective element in the package sites of the molding array in the circuit zone can be identified.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a method for identifyingdefective elements in array molding of semiconductor packaging, and moreparticularly to a method for identifying defective elements in arraymolding of semiconductor packaging of mini ball grid array (BGA) type.

[0003] 2. Description of Related Art

[0004] In the light of the trend of “Light, Thin, Short, and Small” ofthe electronic product, in only as short as a decade, the chip packagingtechnology of semiconductor has developed from the “Insertion Mount”type in 1980s to the “Chip Scale Package (CSP) technology of today. The“Insertion Mount” type of chip packages simply mount the chip on thePrint Circuit Board (PCB) while the “Chip Scale Packages (CSP)” havehigh density of electronic devices and are also in three-dimensionalinstead of the two-dimensional that were made previously.

[0005] Following the development in the packaging technology ofultra-fine-pitch, the chip packaging technology performed by the use ofthe lead frame can not satisfy the requirements of this new trendanymore. And the ball grid array (BGA) package with its dominantadvantages has imperceptibly become the main stream of packaging typenowadays, the mini BGA type of packaging is one of the examples.

[0006] The so called mini BGA type of package is a package that isfabricated by first forming a plurality of package sites in array, then,forming electrical connections between the dies and the package sitesrespectively, thereafter, using a molding compound to protect the die.In this way, the dies can electrically exit out to undertake signaltransmission through the connecting points formed in ball shape on thepackage sites and disposed in array.

[0007]FIG. 1 is a schematic top view of a mini BGA packaging substrateaccording to the prior art. As shown in FIG. 1, a common mini BGApackaging is first to form a plurality of package sites 104, which isdisposed in array, in the circuit zone 102 of the mini BGA packagingsubstrate 100. Next, a plurality of dies is electrically connected tothe package sites 104 respectively, then a molding process is performedto encase the whole area of the circuit zone 102 to protect the dies andbond wires by a molding compound. Thereafter, all one has to do is tosaw the overall package into package sites 104 along the borderlines ofthe array to complete the mini BGA packaging process.

[0008] An inspection process is performed after the package sites 104are formed in array on the mini BGA packaging substrate 100 and beforethe plurality of dies is electrically connected to each of the packagesites 104 respectively in accordance with the foregoing statement. Thepurpose of the inspection is to judge initially if there are anydefective package sites 104, in the meantime, to mark them in order todifferentiate them from the good ones. The way of doing this is to putan “X” mark on those defective package sites such as 104 a in FIG. 1.

[0009] However, the mark put on some of the package sites 104, which areinitially judged as defective ones, will be covered by the moldingcompound after the processes of die bonding and array molding arecompleted. Consequently, the defective elements can not be identified.

[0010] In the light of the foregoing disadvantage that the conventionalarray molding is unable to identify the defective elements after thearray molding is completed, the present invention provides anidentification method for identifying the defective elements.

SUMMARY OF THE INVENTION

[0011] The present invention provides a method for identifying defectiveelements in array molding of semiconductor packaging. The method isfirst to provide a mini BGA packaging substrate. Next, it provides acircuit zone on the mini BGA packaging substrate wherein a plurality ofpackage sites disposed in array are formed in the circuit zone. Then, aplurality of marks representing the locations of each of the packagesites are formed in the periphery zone other than the circuit zone onthe mini BGA packaging substrate. Thereafter, it performs an inspectionprocess to those package sites in order to find out the defectiveelements in the package sites. Then, it puts a symbol at those marks inthe periphery zone wherein the symbol put at the marks represents thelocation of defective elements in the package sites. It then performselectrical connection between a plurality of dies and the package sitesrespectively. Finally, it performs an array molding process by the useof a molding compound to cover the dies and the package sites but not tocover the periphery zone. Therefore, one can identify the locations ofthe defective elements in the package sites.

[0012] The present invention also provides a method for identifyingdefective elements in array molding of semiconductor packaging. Themethod is first to provide a mini BGA packaging substrate. Next, itprovides a circuit zone on the mini BGA packaging substrate wherein aplurality of package sites disposed in array are formed in the circuitzone. Then, a plurality of marks representing the locations of each ofthe package sites is formed in the periphery zone. Thereafter, aninspection process is performed to those package sites in order to findout the defective elements in the package sites. Then, the locations ofdefective elements of the package sites are recorded in an electronicfile so that the locations of the defective elements in the packagesites can be identified at any time. Then electrical connection isformed between a plurality of dies and the package sites respectively.Finally, an array molding process is performed by the use of a moldingcompound to cover the dies and the package sites. In this way, thelocations of defective elements in the package sites can be identifiedfrom the electronic files.

BRIEF DESCRIPTION OF DRAWINGS

[0013] The objectives, characteristics, and advantages of the presentinvention can be more fully understood by reading the following detaileddescription of the preferred embodiments, with reference made to theaccompanying drawings as follows:

[0014]FIG. 1 is a schematic top view of a mini BGA packaging substrateaccording to the prior art.

[0015]FIG. 2 is a schematic top view of a mini BGA packaging substrateof a preferred embodiment according to the present invention.

[0016]FIG. 3 is a schematic enlarged view of the area “A” as shown inFIG. 2 according to the present invention.

[0017]FIG. 4 and FIG. 5 are schematic top views of a mini BGA packagingsubstrate of another two preferred embodiments according to the presentinvention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENT

[0018]FIG. 2 is a schematic top view of a mini BGA packaging substrateof a preferred embodiment according to the present invention. As shownin FIG. 2, a mini BGA packaging substrate 200 can be separated into acircuit zone 202 a and a periphery zone 202 b. The circuit zone 202 a isfor forming a plurality of package sites 204, which is disposed inarray, in order to electrically connected to a plurality of dies formedin the subsequent process. Mark 206 is formed on the periphery zone 202b to represent the locations of each of the package sites 204. Besides,the material used by the mini BGA packaging substrate 200 can be aBismaleimide-Triazine (BT) epoxy for instance.

[0019] The mark 206, which is formed in the periphery zone 202 b and areused for representing the locations of each of the package sites 204,can be formed by a two-dimensional array of coordinate. Thus, therepresentative location of each of the package sites 204 can beexpressed by the (X,Y) form.

[0020]FIG. 3 is a schematic enlarged view of the area “A” as shown inFIG. 2 according to the present invention. As shown in FIG. 3, if adefective element is found at location (6,3) of package site 204 a (seealso in FIG. 2). Then, a symbol 208 with a cross-wise line segment, forexample, can be drawn on the top (6,3) of the mark 206 to be identified.

[0021] Since the molding process, which is performed after the diescomplete electrical connection, of the mini BGA packaging substrate 200encases the molding compound on the package sites 204 only, but not onthe periphery zone 202 b, thereby, the mark 206 will not be covered bythe molding compound. Consequently, the symbol 208 used for labeling adefective element before a molding process is performed will not becovered by the molding compound after the molding process is performed.Therefore, although the molding process is completed, the defectiveelements can still be identified.

[0022]FIG. 4 and FIG. 5 are schematic top views of a mini BGA packagingsubstrate of another two preferred embodiments according to the presentinvention. As shown in FIG. 4, besides using (X,Y) as a mark 206 tostand for the location of the package sites 204, a mark in the form ofXY can also be employed.

[0023] As shown in FIG. 5, a mark 206 having one-dimensional array canalso be employed, for instance, the locations of each of the packagesites 204 in X-column can be labeled on a side of each of the packagesites 204 in Y-row on the periphery zone 202 b.

[0024] However, the space available in the periphery zone 202 b duringthe packaging process of the mini BGA packaging substrate 200 is gettingsmaller and smaller due to the advent of integration of semiconductor.Therefore, the mark used for representing the locations of each of thepackage sites are getting harder to form in the periphery zone. This isbecause that the package sites 204 used by the mini BGA packaging aredensely disposed, and the design of the package is also under theconsideration of “striving for the best” and cost-effective in packagingprocess. To overcome this problem, the mark 206 as mentioned above invarious embodiments can also be stored in a computer by the means ofelectronic files. Base on this, as long as the electronic files thatrecord the locations of the defective elements are moving together withthe packaging process, the locations of the defective elements can stillbe identified even after the molding process is completed.

[0025] To sum up, the present invention first forms locating mark on theperiphery zone, which does not have array molding package sites formed,of a mini BGA packaging substrate in order to label the locations of thepackage sites. When defective elements are found in the package sites,one can put symbols at the mark on the periphery zone in the locationscorresponding to those of the package sites, or records them by the useof electronic files. In this way, the defective elements in the packagesite array can be identified even after the array molding process iscompleted.

[0026] In additions, the symbols for identifying the defective elementsof the present invention are labeled at the corresponding mark on theperiphery zone that is not covered by the molding compound or arerecorded in electronic files. Therefore, the defective elements canstill be identified easily even after the molding process is completed.

[0027] The invention has been described using an exemplary preferredembodiment. However, it is to be understood that the scope of theinvention is not limited to the disclosed embodiment. On the contrary,it is intended to cover various modifications and similar arrangements.The scope of the claims, therefore, should be accorded the broadestinterpretation so as to encompass all such modifications and similararrangements.

What is claimed is:
 1. A method for identifying defective elements inarray molding of semiconductor packaging comprising: providing a miniBGA(ball grid array) packaging substrate; forming a circuit zone on themini BGA packaging substrate wherein a plurality of package sitesdisposed in array are formed in the circuit zone, and a plurality ofmarks representing the locations of each of the package sites are formedin the periphery zone other than the circuit zone on the mini BGApackaging substrate; performing an inspection process to those packagesites in order to find out the defective elements in the package sites;and labeling a symbol at those marks in the periphery zone wherein thesymbol labeled at the marks represents the locations of defectiveelements in the package sites.
 2. The method for identifying defectiveelements in array molding of semiconductor packaging of claim 1 whereinthe material employed by the mini BGA packaging substrate comprisesBismaleimide-Triazine (BT) epoxy.
 3. The method for identifyingdefective elements in array molding of semiconductor packaging of claim1 wherein those marks are formed in two-dimensional coordinate array. 4.The method for identifying defective elements in array molding ofsemiconductor packaging of claim 1 wherein the those marks are formed inone-dimensional coordinate array.
 5. The method for identifyingdefective elements in array molding of semiconductor packaging of claim1 wherein a method to label a defective element is to draw a cross-wiseline segment at the mark representing defective element in the packagesites.
 6. A method for identifying defective elements in array moldingof semiconductor packaging comprising: providing a mini BGA packagingsubstrate; forming a circuit zone on the mini BGA packaging substratewherein a plurality of package sites disposed in array are formed in thecircuit zone, and a plurality of marks representing the locations ofeach of the package sites are formed in the periphery zone other thanthe circuit zone on the mini BGA packaging substrate; performing aninspection process to those package sites in order to find out thedefective elements in the package sites; and labeling a symbol at thosemarks in the periphery zone wherein the symbol labeled at the marksrepresents the location of defective elements in the package sites.forming electrical connections between a plurality of dies and thepackage sites respectively; and performing an array molding process bythe use of a molding compound to cover the dies and the package sitesbut not to cover the periphery zone, and further to identify thelocations of the defective elements in the package sites.
 7. The methodfor identifying defective elements in array molding of semiconductorpackaging of claim 6 wherein the material employed by the mini BGApackaging substrate comprises Bismaleimide-Triazine (BT) epoxy.
 8. Themethod for identifying defective elements in array molding ofsemiconductor packaging of claim 6 wherein those marks are formed intwo-dimensional coordinate array.
 9. The method for identifyingdefective elements in array molding of semiconductor packaging of claim6 wherein the those marks are formed in one-dimensional coordinatearray.
 10. The method for identifying defective elements in arraymolding of semiconductor packaging of claim 6 wherein a method to labela defective element is to draw a cross-wise line segment at the markrepresenting the defective element in the package sites.
 11. A methodfor identifying defective elements in array molding of semiconductorpackaging comprising: providing a mini BGA packaging substrate; forminga circuit zone on the mini BGA packaging substrate wherein a pluralityof package sites disposed in array are formed in the circuit zone;performing an inspection process to those package sites in order to findout the defective elements in the package sites; and recording thelocations of defective elements of the package sites in an electronicfile so that the locations of the defective elements in the packagesites can be identified at any time.
 12. The method for identifyingdefective elements in array molding of semiconductor packaging of claim11 wherein the material employed by the mini BGA packaging substratecomprises Bismaleimide-Triazine (BT) epoxy.
 13. A method for identifyingdefective elements in array molding of semiconductor packagingcomprising: providing a mini BGA packaging substrate; forming a circuitzone on the mini BGA packaging substrate wherein a plurality of packagesites disposed in array are formed in the circuit zone; performing aninspection process to those package sites in order to find out thedefective elements in the package sites; recording the locations ofdefective elements of the package sites in an electronic file so thatthe locations of the defective elements in the package sites can beidentified at any time. forming electrical connection between aplurality of dies and the package sites respectively; and performing anarray molding process by the use of a molding compound to cover the diesand the package sites, and to identify the locations of the defectiveelements in the package sites from the electronic files.
 14. The methodfor identifying defective elements in array molding of semiconductorpackaging of claim 13 wherein the material employed by the mini BGApackaging substrate comprises Bismaleimide-Triazine (BT) epoxy.